使用者43405071469887492019-11-16 01:38:14

流程簡介：開料Cut Lamination－－鑽孔Drilling－－幹膜製程Photo Process（D/F）－－壓合Lamination－－減銅Copper Reduction－－電鍍Horizontal Electrolytic Plating－－塞孔Plug Hole－－防焊（綠漆/綠油）Solder Mask－－鍍金Gold plating－－噴錫Hot Air Solder Leveling－－成型Profile－－開短路測試Electrical Testing－－終檢Final Visual Inspection